Wafers are highly prone to rapid oxidation and defect formation after etching. Conventional wet processing equipment fails to balance low-oxygen, cleanliness, corrosion resistance and safety, resulting in batch scrappage, soaring costs and persistent production line risks.
HualinKena’s Smart Clean Low-Oxygen Wet Process Workstation eliminates oxidation-related losses from the source through three core technologies:
- Top FFU Intelligent Nitrogen Circulation & Purification SystemEquipped with a top FFU high-efficiency nitrogen circulation unit, high-purity nitrogen is delivered into the operation chamber in vertical laminar flow to quickly replace oxygen-containing air. It maintains a stable low-oxygen atmosphere, cuts off oxidation triggers environmentally, and suppresses surface oxidation of workpieces.
- Real-Time Online O₂ Concentration MonitorBuilt with high-precision oxygen sensors for 24/7 dynamic monitoring of oxygen content inside the chamber, with real-time data visualization. It automatically broadcasts “Safe to operate” when oxygen concentration meets standards, and issues instant alarms for over-limit conditions. The whole process is controllable and traceable to ensure stable low-oxygen processing.
- Closed-Loop Low-Oxygen Flow Design for the Whole ProcessWorkpieces are fully enclosed from loading, acid/alkali bath processing, multi-stage rinsing to unloading, with full nitrogen coverage. This drastically shortens the oxidation window, completely eliminates surface oxidation, discoloration and defects, and significantly improves product yield and reliability.
Applicable Semiconductor & Precision Manufacturing Scenarios
This equipment is engineered for high-risk, high-cleanliness and highly corrosive processes, fully matching the semiconductor and general semiconductor industry chains.
1. Core Semiconductor Scenarios
Advanced Wafer Wet Processing: Wafer photolithography cleaning, RCA cleaning, particle/organic/metal removal. Low-oxygen atmosphere inhibits surface oxidation and boosts yield.
High-Precision Acid/Alkali Etching: Acid/alkali etching, post-etching cleaning and selective etching of silicon, SiC, GaN and other materials. Corrosion-resistant and cross-contamination-free to guarantee process precision.
Advanced Packaging Wet Processes: Flip-chip, fan-out, 2.5D/3D packaging cleaning, photoresist stripping and micro-etching, meeting ultra-high cleanliness and low-oxygen requirements.
Third-Generation Semiconductor R&D and Mass Production: Inert protection for wide-bandgap materials to prevent oxidation of sensitive materials and stabilize yield.
Laboratory R&D and Pilot Lines: Universities, research institutes and IDM small-batch trial production, fully compliant with data recording and traceability.
High-Risk Chemical Handling: Preparation, use and temporary storage of highly corrosive reagents such as HF, HCl, H₂SO₄, H₂O₂, NaOH and KOH, with a full-process safety closed loop.
2. Optics Industry
Applicable Products: Optical lenses, prisms, windows, filters, laser optics, infrared components, photolithography objectives.
Core Processes: Precision cleaning before coating, acid etching polishing, photoresist stripping, surface modification, passivation.
Value: Low-oxygen atmosphere prevents oxidation, fogging and yellowing; Class 100 cleanliness avoids particles, water marks and coating defects for high transmittance and imaging quality; corrosion-resistant materials adapt to HF, BOE and other etchants with zero acid mist leakage for enhanced safety.
3. Glass Industry
Applicable Products: Borosilicate glass, quartz glass, sapphire glass, cover glass, optical glass substrates, TGV glass interposers, display glass substrates.
Core Processes: Glass etching, thinning, polishing cleaning, photoresist stripping, pre-coating treatment, pre-heterogeneous bonding cleaning.
Value: Low-oxygen atmosphere avoids iridescence, whitening and increased haze; Class 100 cleanliness ensures surface flatness and roughness; fully sealed design solves acid mist issues in glass etching, complying with environmental and safety regulations.
4. Display Panel Industry
Applicable Products: LCD/OLED/Micro-LED glass substrates, touch panels, color filters.
Core Processes: Substrate cleaning, TFT etching, photoresist stripping, pre-packaging treatment.
Value: Low-oxygen protection prevents oxidation of metal electrodes/ITO layers and improves display uniformity; Class 100 cleanliness eliminates bright/dark dot defects; high corrosion resistance adapts to strong acid panel processes.
5. Photovoltaic & New Energy Industry
Applicable Products: Mono/poly silicon wafers, HJT/IBC cells, perovskite cells, photovoltaic glass.
Core Processes: Texturing, acid polishing, cleaning, anti-cross plating treatment, pre-coating preparation.
Value: Low-oxygen protection prevents oxidation of silicon wafers/metal grid lines and improves conversion efficiency; cleanliness reduces contamination, leakage and attenuation; corrosion resistance adapts to photovoltaic-specific acid systems.
6. Other Precision Manufacturing Scenarios
Precision Electronic Ceramics: Cleaning, pre-metallization treatment and etching of ceramic substrates and ceramic packages.
Medical Optics & Microfluidics: Ultra-clean cleaning and microstructure etching of medical glass and microfluidic chips.
Aerospace Precision Optics: High-reliability cleaning and pre-coating treatment of aerospace lenses, LiDAR optics and infrared windows.
