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Revealing the Black Tech of Fume Hoods: Intelligent Wet Process Workstation Built for Semiconductors

In cutting-edge and high-risk semiconductor processes such as wet processing, acid etching, and cleaning, traditional fume hoods can no longer meet stringent safety, cleanliness, and efficiency requirements. The Hualing Kena CSE Intelligent Wet Process Workstation has completely upgraded laboratory fume hoods. With four core black techs—modular structure, full-link safety interlock, precise parameter control, and intelligent voice operation and maintenance—it redefines the benchmark for safety and efficiency of ventilation equipment in semiconductor wet processes, fully complying with SEMI standards and clean laboratory regulations.


I. Modular Black Tech: 3-in-1 Structure for Full-Scenario Adaptation

This intelligent wet process workstation breaks the single-function limitation of traditional fume hoods, creating a standardized 3-in-1 model with top clean air supply + middle process operation + bottom reagent storage for full-scenario coverage.
    • 1.Top FFU Clean Air Supply: Vertical laminar flow air supply with a stable face velocity of 0.35–0.55 m/s, forming a positive-pressure air curtain to block external contamination and protect the cleanliness of precision components such as wafers.

    • 2.Middle Operation Area: Window-linked variable air volume design, air flow uniformity ≥90%, no turbulence or dead zones, ensuring no escape of harmful gases during process operations.

    • 3.Bottom Intelligent Reagent Cabinet + Waste Liquid Recovery: Corrosion-resistant sealed cabinet with nitrogen-filled moisture protection, suitable for easily oxidized chemicals; fully anti-corrosive PP waste liquid tray + secondary recovery design, completely eliminating liquid overflow and diffusion.

It adopts top-supply bottom-exhaust counter airflow, with face velocity precisely controlled at 0.3–0.5 m/s and deviation ≤±2%. The harmful gas capture efficiency exceeds 99.999%, blocking contamination and leakage risks from the airflow source.


II. Safety Black Tech: Full-Link Interlock for Zero-Risk Protection in Highly Corrosive Scenarios

Semiconductor wet processes frequently involve highly corrosive media such as HF, HCl, and H₂SO₄, making safety the bottom line. This workstation builds a full-link safety system with multiple protections + real-time monitoring:


1. Multiple Safety Interlocks

    • Infrared sensor door opening: the fan accelerates response within 1 second, and exhaust air volume instantly reaches the safety threshold.

    • Window height linked to air velocity: automatic enhanced exhaust when exceeding limits, audible and visual alarm if not closed overtime.

    • Optional automatic fire extinguishing with flame/smoke/temperature sensors: cuts off the fan and closes fire dampers within 3 seconds of fire detection for rapid fire control.

2. Corrosion and Leakage Protection

  • Cabinet made of PP/SUS316L anti-corrosive materials, corrosion resistance grade ≥10, resistant to highly corrosive media; built-in waste liquid leakage sensor, high-brightness alarm immediately upon leakage to prevent accidents caused by chemical diffusion.

3. Real-Time Environmental Monitoring

  • Optional sensors for HF, HCl, flammable gases, etc., with detection accuracy ±0.1%, automatic maximum air volume exhaust when concentration exceeds limits; reagent cabinet temperature and humidity accuracy ±0.1℃/±1% RH, sampled once per second, fully controllable and traceable.


III. Intelligent Black Tech: Zero-Contact Voice Control for Efficient Operation and Maintenance

To meet the core needs of cross-contamination prevention and misoperation prevention in semiconductor clean laboratories, the workstation is equipped with an industrial-grade intelligent voice system for full zero-contact operation:
    • Response time <0.5 seconds, recognition accuracy ≥99.2% in ≤67dB high-noise environment, supports Mandarin and industrial terms; voice control for start/stop, air volume adjustment, window lifting, nitrogen filling.

    • Voice safety linkage: automatic safety exhaust activation when personnel approach, synchronous voice broadcast + audible and visual prompts during alarms, zero-delay information transmission.

    • Variable-frequency fan adaptive speed regulation, energy saving ≥30% compared with traditional fixed-frequency models; dual pressure difference + time model for high-efficiency filters, 72-hour early warning for replacement, easier operation and maintenance.


IV. Standardized Hard Parameters: Defining a New Benchmark for Wet Process Ventilation with Data

All performance is implemented with quantifiable hard indicators, rejecting vague standards:
    • Ventilation: face velocity 0.3–0.5 m/s, deviation ≤±2%, exhaust air volume adjustable from 1000–1600 m³/h.

    • Filtration: HEPA/ULPA high-efficiency filters, filtration efficiency ≥99.999% @0.12μm.

    • Response: air velocity adjustment <1 second, voice response <0.5 seconds, meeting ultra-fast safety response requirements.

    • Materials: PP/SUS316L anti-corrosive cabinet, standard anti-corrosive water-gas gun, 10A explosion-proof anti-fog socket, suitable for harsh semiconductor working conditions.


From laboratory R&D to mass production processes, the Hualing Kena Intelligent Wet Process Workstation goes beyond the limitations of traditional fume hoods. With four black techs—modularization, safety, intelligence, and standardization—it provides stable, compliant, and efficient ventilation protection for high-risk links such as semiconductor wet processing, acid etching, and cleaning, becoming a hardcore escort for cost reduction, efficiency improvement, and safe operation in high-end processes.