In semiconductor and general semiconductor wet processes, low-oxygen control, cleanliness, corrosion resistance, and safe operation are the core factors determining process stability and product yield. As a wet process station specially designed for high-precision, highly corrosive, and oxidation-prone scenarios, the key technical parameters and performance indicators of the low-oxygen wet bench directly determine whether the equipment can meet advanced process requirements. Based on Hualing Kena Smart Clean Low-Oxygen Wet Process Workstation, the core technical parameters and performance indicators of such equipment are summarized below.
1. Core Environmental Control Parameters
1.1 Oxygen Content Control
Equipped with a top FFU intelligent nitrogen circulation system, clean nitrogen is delivered to the operation area in vertical laminar flow to quickly replace oxygen-containing air and create a nearly oxygen-free process environment. Built-in real-time O₂ concentration detector enables visual monitoring of oxygen content and automatic voice broadcast when standards are met. Fully enclosed low-oxygen transfer throughout the process strictly controls oxidation risks.
1.2 Cleanliness Indicators
Adopts dual purification of FFU + high-efficiency filter, with filtration efficiency ≥99.999% @ 0.12μm, stably achieving Class 100 dust-free cleanliness.
Vertical laminar face velocity: 0.36–0.55 m/s, deviation ≤±2%, airflow uniformity ≥90%, no turbulence or dead zones, effectively avoiding wafer water marks and particle contamination.
1.3 Temperature & Humidity Monitoring
Real-time monitoring of temperature and humidity in the working area with 1-second high-frequency sampling, accuracy: ±0.1℃ / ±1% RH, effectively preventing condensation and ensuring surface cleanliness of devices.
2. Equipment Structure & Process Adaptation Parameters
2.1 Equipment Dimensions
Standard size: 2500(L) × 1000(W) × 2000(H) mm, suitable for pilot and small-batch production lines of 8/12-inch semiconductor wafers, with efficient installation and deployment.
2.2 Station Configuration
The process tank area is equipped with 3 standard stations as standard:
Ø Station 1: PVDF/PTFE acid (alkali) tank (with heating, precise temperature control, and air extraction)
Ø Station 2: Multi-functional rinsing tank (spray / overflow / bubbling / fast discharge)
Ø Station 3: Work surface + waste liquid recovery system
Full process coverage.
2.3 Anti-Corrosion Materials
Adopts Grade 5/10 PP board + PVDF/PTFE anti-corrosion materials. Corrosion resistance grade of cabinet / work surface ≥Grade 10, resistant to strong acids and alkalis such as HF and HCl, suitable for various harsh wet processes.
3. Exhaust & Safety Performance Parameters
3.1 Exhaust System
Exhaust air volume: 1000~1600 m³/h adjustable with automatic pressurization. Fully sealed design of the whole machine + powerful air extraction system, harmful gas capture efficiency > 99.999%, achieving zero acid mist leakage.
3.2 Safety Monitoring & Alarm
Ø Intelligent liquid leakage alarm: voice broadcast + three-color light warning, accurate leakage location
Ø Gas detection accuracy: 0.01 ppm, ultra-sensitive early warning
Ø Grounding resistance: < 10Ω, safer anti-static
Ø Operating noise: ≤ 67 dB(A), low noise and stable
4. Intelligent Control & Operation & Maintenance Parameters
4.1 AI Voice Interaction
Industrial-grade noise-reduction voice system, recognition rate ≥99.2% in <67dB environment, response time < 0.5s, supporting full contactless control of the equipment.
4.2 Energy Saving & Linked Control
Variable-frequency fan with adaptive speed regulation, energy saving ≥30% compared with traditional models. Supports access to 485 / Ethernet / MQTT protocols, realizing centralized multi-machine control, remote diagnosis and online upgrade.
4.3 Data Traceability
Automatic storage of operating data, supporting historical curve viewing, Excel export, and complete alarm record archiving to meet audit and traceability requirements.
Supported by core performances such as precise oxygen control, Class 100 cleanliness, high corrosion resistance, safety & intelligence, and modular integration, the low-oxygen wet bench meets the requirements of advanced wet processes in all key technical parameters. It effectively solves industry pain points such as oxidation, contamination, corrosion, and acid mist leakage, providing stable and reliable equipment support for wet processes in semiconductor, photovoltaic, display, optics and other fields.
